Delivery lead times for IC packaging and testing machines have shortened notably amid weakening demand and improving supply of basic ICs used in the machines, according to industry sources. Save my ...

Ottawa, Oct. 22, 2024 (GLOBE NEWSWIRE) -- The global semiconductor & IC packaging materials market size is predicted to increase from USD 48.54 billion in 2025 to approximately USD 113.29 billion by ...

Several vendors are ramping up new inspection equipment based on infrared, optical, and X-ray technologies in an effort to reduce defects in current and future IC packages. While all of these ...

The back-end semiconductor manufacturing process refers to the IC packaging and testing that people often hear about. Specifically, the process known as chip probing (CP) is conducted to test the ...

Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...

Another common challenge is the time required for verification signoff prior to manufacture. The proven way to avoid this bottleneck and its related impacts is to implement a process and methodology ...

(MENAFN- Asia Times) Advanced IC packaging is a hot new source of competition among manufacturers of AI processors and other advanced integrated circuits (ICs), and emerging as the next front in the ...

The IC packaging industry is bracing for slower growth, if not uncertainty, in 2019, even though advanced packaging remains a bright spot in the market. Generally, IC packaging houses saw strong ...