Continuous miniaturization & increased component density on PCB's has created a demand for a very low profile connector on a 0.4mm pitch that stacks at 0.9mm high. The DF30 connector meets these ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Avishtech (www.avishtech.com), the leading provider of innovative EDA stack-up and 2D field solver solutions, today announced significant enhancements to its Gauss ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Avishtech (www.avishtech.com), the leading provider of innovative EDA stack-up and 2D field solver solutions, today announced the availability of the latest version ...

Advances in the development of high power and high performance electronic devices demand innovative approaches for heat transfer materials. While it is given that thermal performance must be maximized ...

The printed circuit board (PCB) industry, like almost all in the technology sector, has experienced extraordinary growth and change since its inception in the early 20th century. Changes in component ...

PCB Signal integrity & Stackup design. Ever more complex PCB designs require layer stackups to be considered even before you layout the design. As a designer there are now vast choices of base ...

You have just completed the layout of your latest space-electronics’ project, simulated and verified the physical implementations of your circuits, and are now ready to email the stack details as well ...

Building electronics in unconventional form factors with high packaging density is possible thanks to three-dimensional circuit designs using flex and rigid-flex printed circuit boards (PCBs).

Electronic products must be reliable and durable, especially when they are designed to operate in harsh environments. Building printed circuit boards (PCBs) to work efficiently in extreme ...